iTechCon 2026: Co-Designing Chips and Software for the Era of Agentic and Physical AI – EE Times

iTechCon 2026 will focus on the co-design of semiconductors and software to address emerging demands in agentic and physical AI applications. The conference will bring together industry leaders to discuss how integrated chip-software development strategies can optimize performance for next-generation AI systems. Attendees will explore technical approaches for building hardware and software solutions tailored to the evolving landscape of autonomous and physically-capable AI technologies.

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