“AI Data Center Cooling, Assembled Like Lego”… LG Electronics Bets on Modular Cooling Equipment – 매일경제

LG Electronics is developing modular cooling equipment designed for AI data centers that can be assembled and configured like building blocks. The company’s approach aims to offer flexible, scalable cooling solutions that can be customized to meet varying data center requirements. This modular strategy positions LG to address the growing cooling demands of rapidly expanding AI infrastructure globally.

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