NVIDIA’s CoWoS AI Chip Packaging Demand To Be Foreshadowed In 2027 By AMD Due To Agentic AI CPU Ramp, Says Morgan Stanley – Wccftech

Morgan Stanley analysts suggest that AMD’s agentic AI CPU ramp-up will provide early indicators of demand for NVIDIA’s CoWoS advanced chip packaging technology, with this trend expected to become apparent by 2027. The forecast indicates growing competition in AI infrastructure as both companies scale their respective processor offerings to meet accelerating agentic AI workload requirements.

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